Difference between wave soldering and reflow soldering 1:
The reflow soldering process is the soldering of the mechanical and electrical connections between the terminations of surface mount components or the pins and the printed board pads by remelting the paste-like solder pre-distributed on the printed board pads.
Wave soldering has a new soldering process with the enhancement of people's awareness of environmental protection. In the past, tin-lead alloys were used, but lead is a heavy metal that is very harmful to the human body. So now there is the production of lead technology. It uses tin-silver-copper alloy and special flux and requires higher soldering temperature and higher preheating temperature. It is also necessary to set up a cooling zone workstation after the PCB board passes through the soldering area. This aspect is to prevent heat Impact On the other hand, if there is ICT, it will affect the detection.
Wave soldering can basically be explained as: it solders slightly larger and relatively smaller components. The difference between it and reflow soldering is that, while reflow soldering heats the board and components, it actually liquefies the solder paste that was originally brushed on. , in order to achieve the purpose of connecting the components to the board.
1. Reflow soldering passes through the preheating zone, the reflow zone and the cooling zone. In addition, wave soldering is suitable for hand-plug boards and dispensing boards, and all components are required to be heat-resistant. The surface of the wave should not have components that used to be SMT solder paste. The board with SMT solder paste can only be reflow soldered, not Use wave soldering.
2. Wave soldering is to dissolve the tin bar into a liquid state through the tin bath, and use the motor to stir to form a wave, so that the PCB and the parts are welded together. Reflow soldering is mainly used in the SMT industry. It melts the solder paste printed on the PCB and welds the parts through hot air or other heat radiation conduction.
3. Different processes: wave soldering should first spray flux, then go through preheating, welding and cooling zones.
Difference between wave soldering and reflow soldering 2:
Wave soldering is mainly used for soldering plug-ins; reflow soldering is mainly used for soldering SMD components.
1. Wave soldering is to dissolve the tin bar into a liquid state through the tin bath, and use the motor to stir to form a wave, so that the PCB and the parts are welded together. Reflow soldering is mainly used in the SMT industry. It melts the solder paste printed on the PCB and welds the parts through hot air or other heat radiation conduction.
2. The process is different: the wave soldering should be sprayed with flux first, and then go through the preheating, welding and cooling zones. Reflow soldering passes through the preheating zone, the reflow zone, and the cooling zone. In addition, wave soldering is suitable for hand-plug boards and dispensing boards, and all components are required to be heat-resistant. The surface of the wave should not have components that used to be SMT solder paste. The board with SMT solder paste can only be reflowed and cannot be used. wave soldering.
