When using reflow soldering technology, chip components are likely to stand up when they encounter very rapid heating. Therefore, during reflow soldering, it is very important to prevent components from sticking up. Share here How to prevent reflow soldering components from standing up.
Generally speaking, in order to effectively prevent components from standing up, it is best to choose the kind with strong adhesion when purchasing solder paste, and the printing accuracy of solder and component placement accuracy should be improved.
The exterior of the element needs to have good wettability and wet stability. Recommendation: The temperature is below 40℃, the humidity is below 70%RH, and the service life of the incoming components should not exceed 6 months.
The setting of reflow soldering temperature management conditions is also a factor in the rise of components. The usual goal is to heat uniformly, especially before the solder fillet of the two connecting ends of the component is formed, and the uniform heating must not fluctuate.
Small pad width and size can be used, which can reduce the tension on the end of the component caused by the melting of the solder, and can also appropriately reduce the printing thickness of the solder.
The warping of the SMT chip component under the condition of rapid heating is caused by the rapid heat causing the temperature difference between the two ends of the component. Wetting is poor, which promotes component lift. Therefore, when reflowing heating, it is necessary to consider the time factor, so that the heating in the horizontal direction forms a balanced temperature distribution to avoid the generation of rapid heating.
