1. The reflow soldering process should set a reasonable reflow soldering temperature profile - reflow soldering is a key process in SMT production. Improper temperature profile setting will lead to incomplete soldering, virtual soldering, component wings, and more solder beads. Defects that affect product quality.
2. Reflow soldering should be performed according to the soldering direction of the PCB design.
3. During the reflow soldering process, strictly prevent the conveyor belt from vibrating.
4. The reflow soldering effect of the first printed board must be checked. Check whether the soldering is complete, whether there are traces of insufficient solder paste melting, whether the surface of the solder joint is smooth, whether the solder joint is half-shaped at the beginning, the situation of solder balls and residues, the situation of continuous soldering and virtual soldering, etc.; Check the color change on the PCB surface. The temperature curve should be adjusted appropriately according to the inspection results. In the mass production process, the welding quality should be checked regularly, and the temperature curve should be adjusted in time.
